球柵陣列尺寸封裝的有限元法模擬及焊點的壽命預測分析.pdf

1、浙江工業(yè)大學碩士學位論文球柵陣列尺寸封裝的有限元法模擬及焊點的壽命預測分析姓名：許楊劍申請學位級別：碩士專業(yè)：機械設計及理論指導教師：劉勇20040501Finite—ElementSimulationandSolderJointLifePredictionsforChipScaleBallGridArraySizePackage4ABSTRACTAtpresemBGA：CSPisbecomingthemainstreamofthead

2、vanced配packagetechnologyItsdevelopmentiSbaseduponthesolutionofthereliabiliWofsolderball，whichisoneofthekeyproblems，囂isprovedthatthermalfatigueisthemaincauseoftheinvalidityofthepackage。Therefore，itissignificanttesearchthe

3、reliabilityofsolderballunderthethermalcycleInthispaper，BGA／CSPissimulatedandanalyzedasimplementedintheANSYSfiniteelementsimulationsoftwaretomtoevaluatetheaffectOnitsreliabilit并theconstitutivemodelofthesolderbailisconstru

4、ctedtentativelytofindabetterdescriFItionforthesolderballFirstthepaperdiscussesbrieflytheICpackagetechnology，thereliabilityanalysismethodologiesandthecnlTentsituationofthe囂packageSecond縫constructsatypicalBGA／CSP3Dmodelbyp

5、rogrammingtheAPDLcode，thenanalyzesitslifepredictionThird，itanalyzesdifferentinfluencesuponthelifepredicationbycomparingdifferentmodelsofthesamepackage，diftbrentconstitutivemodelsofthesamesolderball’Smaterials，differentli

6、fepredictionmodels，dift奄rentsolderballdimensions，differentmeshdensityetcFinally，itcomp甜essomepopulareonsfittaivemodelsofthesolderballmaterials，andconstructs8nintegratedconstitutivemodelbydifferentclllvefits。Thepapermakes

7、a“secondexploitatioff’ofANSYSforsolvingcertainproblemsthroughFORTRANandAPDLprogrmnminginordertoapplytheANSYSfiniteelementsimulationsoftwaretoolmoleconvenientlyandeffectively犧thesimulationanalysisoftheICpackageKEYWORDS：li