光學表面等離子體加工機理研究.pdf

1、西安工業(yè)大學碩士學位論文光學表面等離子體加工機理研究姓名：田園申請學位級別：碩士專業(yè)：光學工程指導教師：劉衛(wèi)國20100517MechanismofOpticalSurfaceMachininginPlasmaDiscipline：OpticalEngineeringStudentSignature：7；’肌機SupervisorSignature：b認咖擴矽AbstractWiththedevelopmentofopticsandit

2、srelatedtechnology，especiallytheshortwaveopticsandhighpowerlasertechnologythesurfaceroughnessofopticalelementsarerequiredtobelessthanlnmandthesurfaceandsub—surfacedamageareforbiddenTheopticalsurfacemachininginplasmaisane

3、mergingandpotentialsupersmoothsurfaceprocessingtechnologyBasedontheplasmamachiningequipment，theeffectsofdifferentsurfacetreatmenttechnologyandsurfaceconditiononremovalrateandsurfaceroughnessarestudiedTherelationshipbetwe

4、entheremovalrateandexperimentalparametersareanalyzed，includinggasflowrate，RFpowermagneticintensityandpolishingtimeTherelationsbetweenplasmacharacteristicandremovalrateandsurfaceroughnessaredefinedThemachiningmechanismofo

5、pticalsurfaceusingplasmaispreliminaryrevealedTheresultsofthisresearcharegivenasfollowsThemachiningeffectsarebetterinusing100MHzplasmasourcethanin1356MMHzTheremovalrateshowsapeakvaluewiththe02maSsflowincreaSingHoweveritli

6、nearlyincreaSeswiththeincreaseofRFpowerandmagneticintensityTheopticalsurfaceroughnessinitiallyincreaSes，andthenmonotonicallydecreaSeswiththeincreaSeof02maSsflowMoreovertheopticalsurfaceroughnessalsodecreaSes、析mtheincreaS

7、eofRFpowerandmagneticintensityThereareobviousremovalamountsuntil20minpolishing，andthentheremovalamountsincreaselinearlywiththepolishingtimeThesurfaceroughnessdecreaSebeforethepolishingtimeis80minandincreaSewiththepolishi

8、ngtimemorethan80minTheremovalrateandsurfaceroughnessvaries、析thdifferentsurfaceconditionWhenspinningglycolether011thesubstrate，theremovalratereachesmaximumvalueof67nm／minandthesurfaceroughnessisuptominimumvalueof083am(RMS