j-std-020d(中英文對照版)

1、J-STD-020DMoisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices非密封固態(tài)表面貼裝元件濕度/回流焊敏感度分級1 PURPOSE(目的） 目的）The purpose of this standard is to identify the classification level of nonherm

2、etic solid state surface mount devices (SMDs) that are sensitive to moisture-induced stress so that they can be properly packaged, stored, and handled to avoid damage during assembly solder reflow attachment and/or repai

3、r operations.本標(biāo)準(zhǔn)旨在識別非密封固態(tài)表面貼裝元件的濕度敏感等級以便其能合適的封裝，儲存，作業(yè)以避免在回流和維修作業(yè)中被損傷.This standard may be used to determine what classification/preconditioning level should be used for SMD package qualification. Passing the criteria in

4、this test method is not sufficient by itself to provide assurance of long-term reliability本標(biāo)準(zhǔn)用于判定合格的SMT封裝應(yīng)使用何種等級/預(yù)處理水平.依據(jù)本測試方法且通過對應(yīng)判定標(biāo)準(zhǔn)的元件并不能保證其長期可靠性1.1 Scope（范圍） （范圍） This classification procedure applies to all nonherm

5、etic solid state Surface Mount Devices (SMDs) in packages, which, because of absorbed moisture, could be sensitive to damage during solder reflow. The term SMD as used in this document means plastic encapsulated surface

6、mount packages and other packages made with moisture-permeable materials. The categories are intended to be used by SMD producers to inform users (board assembly operations) of the level of moisture sensitivity of their

7、product devices, and by board assembly operations to ensure that proper handling precautions are applied to moisture/reflow sensitive devices. If no major changes have been made to a previously qualified SMD package, thi

8、s method may be used for reclassification according to 4.2.此分類程序適用于所有非密封固體表面貼裝元件，此部分元件由于吸收濕氣而在回流焊接中容易損傷. 本文件所提及的術(shù)語“SMD”指的是塑封或本體為吸濕材料的元件.分類的目的是為了讓元件制造商能告知元件使用者（PCBA組裝）其產(chǎn)品的濕敏等級，確保元件使用者能恰當(dāng)作業(yè)，如果對之前認(rèn)證過的SMD封裝沒有重大更改，依據(jù)4.2此方法亦可用

9、于元件的再次分類.This standard cannot address all of the possible component, board assembly and product design combinations. However, the standard does provide a test method and criteria for commonly used technologies. Where unc

10、ommon or specialized components or technologies are necessary, the development should include customer/manufacturer involvement and the criteria should include an agreed definition of product acceptance.此標(biāo)準(zhǔn)不能涵蓋所有與設(shè)計，組裝相關(guān)

11、聯(lián)的元件.但是，此標(biāo)準(zhǔn)為通用技術(shù)提供了一個測試方法和標(biāo)準(zhǔn). 如果使用特殊技術(shù)或特殊元件，則需客戶以及相關(guān)的制造方定義一個雙方同意的產(chǎn)品接受標(biāo)準(zhǔn).SMD packages classified to a given moisture sensitivity level by using Procedures or Criteria defined within any previous version of J-STD-020, JESD

12、22-A112 (rescinded), or IPC-SM-786 (rescinded) do not need to be revision unless a change in classification level or a higher peak classification temperature is desired. Annex B provides an overview of major changes from

13、 Revision C to Revision D of this document.在使用之前版本J-STD-020，JESD22-A112（已作廢），IPC-SM-786（已作廢）標(biāo)準(zhǔn)中已分級的濕敏元件除非敏感等級變更或耐溫峰值提高，否則無須重新分級.附件B提供了版本C升級到版本D的主要變更.Note: If the procedures in this document are used on packaged devices t

14、hat are not included in this specification’s scope, the failure criteria for such packages must be agreed upon by the device supplier and their end user備注：當(dāng)封裝元件未在本標(biāo)準(zhǔn)規(guī)格范圍內(nèi)，如需使用此文件中的流程判定，則不良標(biāo)準(zhǔn)需元件供應(yīng)商和其客戶同意.1.2 Background（背景

15、） （背景）The vapor pressure of moisture inside a nonhermetic package increases greatly when the package is exposed to the high temperature of solder reflow. Under certain conditions, this pressure can cause internal delamin

16、ation of the packaging materials from the die and/or leadframe/substrate, internal cracks that do not extend to the outside of the package, bond damage, wire necking, bond lifting, die lifting, thin film cracking, or cra

17、tering beneath the bonds. In the most severe case, the stress can result in external package cracks. This is process.車間壽命：元件從從防潮袋，干燥箱，或烘烤后取出到回流之間允許的時間full body hot air rework – The process of heating a package by directi

18、ng heated gas at the package body in order to melt only that package’s solder connections.本體熱風(fēng)返工：使用熱風(fēng)直接給整個元件本體加熱而使元件焊點(diǎn)融化的過程live-bug (orientation) – The orientation of the package when resting on its terminals封裝術(shù)語：元件引腳朝下的

19、的封裝manufacturer’s exposure time (MET) – The maximum cumulative time after bake that components may be exposed to ambient conditions prior to shipment to the end user.制造商暴露時間：元件烘烤后，在運(yùn)送給終端使用者之前，元件暴露在周邊環(huán)境中最大允許時間.moisture/re

20、flow sensitivity classification – The characterization of a component’s susceptibility to damage due to absorbed moisture when subjected to reflow soldering.濕度/回流敏感分類：元件由于吸收濕氣在回流條件下受損的敏感特性moisture sensitivity level (MSL)

21、 – A rating indicating a component’s susceptibility to damage due to absorbed moisture when subjected to reflow soldering濕敏等級：對于元件吸濕在回流條件下受損敏感性的分級package thickness – The component thickness excluding external terminals (

22、balls, bumps, lands, leads) and/or nonintegral heat sinks封裝厚度：元件除去外部插座,引腳,焊盤，散熱片等的厚度peak package body temperature (Tp) – The highest temperature that an individual package body reaches during MSL classification.元件本體最高溫度：

23、在MSL分類中所規(guī)定的元件本體最高能承受的溫度.reclassification – The process of assigning a new moisture sensitivity level to a previously classified device.重新分類：對之前已分類的元件重新指定新的濕敏等級soak – The exposure of a component for a specified time at a

24、specified temperature and humidity. See also accelerated equivalent soak.浸泡：在特定的溫度和濕度下，元件在特定的時間內(nèi)暴露.3 APPARATUS(設(shè)備） 設(shè)備）3.1 Temperature Humidity Chambers Moisture chamber(s), capable of operating at 85 °C/85% RH, 85 &

25、#176;C/60% RH, 60 °C/60% RH, and 30 °C/60% RH. Within the chamber working area, temperature tolerance must be ± 2 °C and the RH tolerance must be ± 3% RH.恒溫恒濕箱：需滿足85 °C/85% RH, 85 °C/60

26、% RH, 60 °C/60% RH, and 30 °C/60% RH操作要求，且在箱內(nèi)工作區(qū)域溫度誤差必須± 2 °C，濕度誤差3% RH.3.2.1 Full Convection (Preferred) Full convection reflow system capable of maintaining the reflow profiles required by this stan

27、dard全對流3.2.2 Infrared Infrared (IR)/convection solder reflow equipment capable of maintaining the reflow profiles required by this standard. It is required that this equipment use IR to heat only the air and not directly

28、 impinge upon the SMD Packages/ devices under test.紅外回流3.3 Ovens Bake oven capable of operating at 125 +5/-0 °C.烤箱（能滿足125 +5/-0 °C）3.4 Microscopes（顯微鏡） （顯微鏡）3.4.1 Optical Microscope Optical Microscope (40X for

29、external and 100X for cross-section exam, higher magnification might be required for verification).光學(xué)顯微鏡：（40倍用于外部檢查，100倍用于切片檢查）驗(yàn)證中可能要求更高倍數(shù)顯微鏡.3.4.2 Acoustic Microscope Typically a scanning acoustic microscope with C-Mode

30、 and Through Transmission capability. It should be capable of measuring a minimum delamination of 5% of the area being evaluated聲波掃描顯微鏡：具備C-Modec穿透功能，且能量測評估區(qū)域最小5%的分層的能力.3.5 Cross-Sectioning Microsectioning equipment as r