pcb行業(yè)專業(yè)詞匯大全

1、PCB 行業(yè)專業(yè)詞匯大全—馬建整理* Process Module 說明 :A. 下料 ( Cut Lamination)a-1 裁板 ( Sheets Cutting)a-2 原物料發(fā)料 (Panel)(Shear material to Size)B. 鑽孔 (Drilling)b-1 內(nèi)鑽 (Inner Layer Drilling )b-2 一次孔(Outer Layer Drilling )b-3 二次孔 (2nd Dri

2、lling)b-4 雷射鑽孔 (Laser Drilling )(Laser Ablation )b-5 盲(埋)孔鑽孔 (Blind & Buried Hole Drilling)C. 乾膜製程 ( Photo Process(D/F))c-1 前處理 (Pretreatment)c-2 壓 膜 (Dry Film Lamination)c-3 曝 光 (Exposure)c-4 顯 影 (Developing)c-5

3、 蝕銅 (Etching)c-6 去膜 (Stripping)c-7 初檢 ( Touch-up)c-8 化學(xué)前處理,化學(xué)研磨 ( Chemical Milling )c-9 選擇性浸金壓膜 (Selective Gold Dry Film Lamination)c-10 顯 影(Developing )c-11 去膜(Stripping )D. 壓 合 Laminationd-1 黑 化 (Black Oxide T

4、reatment)d-2 微 蝕 (Microetching) d-3 鉚釘組合 (eyelet )d-4 疊板 (Lay up)d-5 壓 合 (Lamination)d-6 後處理 (Post Treatment)d-7 黑氧化 ( Black Oxide Removal )d-8 銑靶 (spot face)d-9 去溢膠 (resin flush removal)E. 減銅 (Copper Reduction)e

5、-1 薄化銅(Copper Reduction)j-4. 印焊錫突點(diǎn) (Solder Bump)K. 成型 (Profile)(Form)k-1 撈型 (N/C Routing ) (Milling)k-2 模具沖 (Punch)k-3 板面清洗烘烤 (Cleaning & Backing)k-4 V 型槽 ( V-Cut)(V-Scoring)k-5 金手指斜邊 ( Beveling of G/F)L. 短斷路測試

6、 (Electrical Testing) (Continuity & Insulation Testing)l-1 AOI 光學(xué)檢查 ( AOI Inspection)l-2 VRS 目檢 (Verified & Repaired)l-3 汎用型治具測試 (Universal Tester)l-4 專用治具測試 (Dedicated Tester)l-5 飛針測試 (Flying Probe)M. 終檢 (

7、Final Visual Inspection)m-1 壓板翹 ( Warpage Remove)m-2 X-OUT 印刷 (X-Out Marking)m-3 包裝 及出貨 (Packing & shipping)m-4 目檢 ( Visual Inspection)m-5 清洗 及烘烤( Final Clean & Baking)m-6 護(hù)銅劑 (ENTEK Cu-106A)(OSP)m-7 離子殘餘

8、量測試 (Ionic Contamination Test )(Cleanliness Test)m-8 冷熱衝擊試驗(yàn) (Thermal cycling Testing)m-9 焊錫性試驗(yàn) ( Solderability Testing )N. 雷射鑽孔(Laser Ablation)N-1 雷射鑽 Tooling 孔 (Laser ablation Tooling Hole)N-2 雷射曝光對位孔(Laser Ablation

9、Registration Hole)N-3 雷射 Mask 製作(Laser Mask)N-4 雷射鑽孔(Laser Ablation)N-5 AOI 檢查及 VRS ( AOI Inspection & Verified & Repaired)N-6 Blaser AOI (after Desmear and Microetching)N-7 除膠渣 (Desmear)N-8 微蝕 (Microetching )A/