集成電路封裝與測(cè)試

1、畢業(yè)設(shè)計(jì)（論文）專(zhuān) 業(yè) 班 次 姓 名 指導(dǎo)老師 指導(dǎo)老師 成都電子機(jī)械高等專(zhuān)科學(xué)校 成都電子機(jī)械高等專(zhuān)科學(xué)校AbstractIC packaging is a challenging and attractive field. It is the integrated ci

2、rcuit chip production after the completion of an indispensable process to work together is a bridge device to the system. Packaging of the production of microelectronic products, quality and competitiveness have a great

3、impact. Under the current popular view of the international community believe that the overall cost of microelectronic devices, the design of a third, accounting for one third of chip production, packaging and testing an

4、d also accounted for a third, it is There are one-third of the world. Packaging research at the global level of development is so rapid, and it faces the challenges and opportunities since the advent of electronic produc

5、ts has never been encountered before; package the issues involved as many as broad, but also in many other fields rare, it needs to process from the material, from inorganic to polymers, from the calculation of large-sca

6、le production equipment and so many seem to have no mechanical connection of the concerted efforts of the experts is a very strong comprehensive new high-tech subjects .Media transmission and detection CPU package is an

7、important part of testing the physical properties of the mixed CPU, a direct impact on product quality. This paper describes a simple process, the structure of the machine and its common problems.Keyword: Packaging Med