2023年全國碩士研究生考試考研英語一試題真題（含答案詳解+作文范文）_第1頁
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1、?ISO2018Roadvehicles—Functionalsafety—Part11:GuidelinesonapplicationofISO26262tosemiconductsVhiculesroutiers—Scuritfonctionnelle—Partie11:LignesdirectricessurlapplicationdelISO26262auxsemiconducteursINTERNATIONALSTARDISO

2、2626211Firstedition201812ReferencenumberISO2626211:2018(E)CopyrightInternationalganizationfStardizationProvidedbyIHSMarkitunderlicensewithANSINotfResale1220201805:12:40MSTNoreproductionwkingpermittedwithoutlicensefromIHS

3、````````````````````ISO2626211:2018(E)Fewd..................................................................................................................................................................................

4、........................................................vIntroduction.......................................................................................................................................................

5、.........................................................................vi1Scope...........................................................................................................................................

6、......................................................................................12Nmativereferences...................................................................................................................

7、...................................................................13Termsdefinitions.......................................................................................................................................

8、..............................................14Asemiconductcomponentitspartitioning............................................................................................................24.1Howtoconsidersemiconduct

9、components.............................................................................................................24.1.1Semiconductcomponentdevelopment................................................................

10、..................................24.2Dividingasemiconductcomponentinparts...........................................................................................................24.3Abouthardwarefaultserrsfailuremodes

11、.....................................................................................................34.3.1Faultmodels......................................................................................................

12、...................................................................34.3.2Failuremodes.......................................................................................................................................

13、..............................44.3.3Thedistributionofbasefailurerateacrossfailuremodes..........................................................44.4Aboutadaptingasemiconductcomponentsafetyanalysistosystemlevel...........

14、......................54.5IntellectualProperty(IP)...............................................................................................................................................................64.5.1About

15、IP...................................................................................................................................................................................64.5.2CategysafetyrequirementsfIP......

16、..............................................................................................74.5.3IPlifecycle.............................................................................................................

17、.................................................................94.5.4WkproductsfIP........................................................................................................................................

18、.........114.5.5IntegrationofblackboxIP...................................................................................................................................144.6Basefailureratefsemiconducts.................

19、...............................................................................................................154.6.1Generalnotesonbasefailurerateestimation...............................................................

20、......................154.6.2Permanentbasefailureratecalculationmethods...........................................................................204.7Semiconductdependentfailureanalysis..................................

21、...............................................................................414.7.1IntroductiontoDFA.....................................................................................................................

22、...............................414.7.2RelationshipbetweenDFAsafetyanalysis..................................................................................424.7.3Dependentfailurescenarios................................

23、...............................................................................................424.7.4Distinctionbetweencadingfailurescommoncausefailures..............................454.7.5Dependentfailureinitiatsmitiga

24、tionmeasures................................................................454.7.6DFAwkflow................................................................................................................................

25、..................................514.7.7Examplesofdependentfailuresanalysis.................................................................................................544.7.8Dependentfailuresbetweensoftwareelementh

26、ardwareelement.......................554.8Faultinjection....................................................................................................................................................................

27、...................554.8.1General...................................................................................................................................................................................554.8.2a

28、cteristicsvariablesoffaultinjection......................................................................................554.8.3Faultinjectionresults.......................................................................

29、........................................................................574.9ProductionOperation............................................................................................................................

30、..............................574.9.1AboutProduction.........................................................................................................................................................574.9.2Producti

31、onWkProducts...................................................................................................................................584.9.3Aboutservice(maintenancerepair)decommissioning........................

32、...............584.10Interfaceswithindistributeddevelopments..............................................................................................................584.11Confirmationmeasures........................

33、........................................................................................................................................594.12Clarificationonhardwareintegrationverification................................

34、....................................................595Specificsemiconducttechnologiesusecases....................................................................................................605.1Digitalcomponentsmemi

35、es.....................................................................................................................................605.1.1Aboutdigitalcomponents........................................................

36、.............................................................................605.1.2Faultmodelsofnonmemydigitalcomponents...........................................................................605.1.3Detailedfaultmode

37、lsofmemies...............................................................................................................615.1.4Failuremodesofdigitalcomponents.............................................................

38、.............................................625.1.5Exampleoffailuremodedefinitionsfcommondigitalblocks.........................................625.1.6Qualitativequantitativeanalysisofdigitalcomponent....................

39、................................665.1.7Notesonquantitativeanalysisofdigitalcomponents..................................................................67?ISO2018–AllrightsreservediiiContentsPageCopyrightInternationalgani

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