L公司無鉛噴錫焊接質(zhì)量改進(jìn)研究.pdf

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3、字日期：年 月 日 簽字日期：年 月 日 ABSTRACT Six Sigma has been proved to be an effective management tool by lots of international companies. In recent years, more and more companies have begun to phase in Six Sig

4、ma. As a subsidiary of GE, company L is also without exception and value highly regarding of Six Sigma Management. Based on this, this thesis selects a product which has been boring the company for a long time with high

5、defective rate and high scrap rate as a Six Sigma improvement project. Firstly, we analyzed the defects data of the second half of 2012. We found that 67.1% of the defects were caused by lead-free PCB for poor soldering

6、issue. Then we used the tree diagram to analyze and identify the project target---- improve the HASL (hot air solder leveling) thickness of the PCB. On this basis, we worked with PCB suppliers to carry out a Measurement

7、System Analysis (MSA) of solder paste’s thickness measurement. Once the MSA was confirmed in available, we selected 4 parameters (air knife’s temperature, pressure, angle and the distance between 2 knives) which would im

8、pact on HASL thickness to do DOE. Per DOE, we determined the optimal parameter settings. And then we used the optimal parameter settings to do a trial run for 30pcs PCBs. The result showed that HASL CPK was increased fro

9、m 0.15 to 1.08 by measuring the solder paste’s thickness of PCB. The defective rate for poor soldering issue is reduced from 1.85% to 0.09%. The total cost savings is $ 28,972. This research of thesis not only improves t