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1、科技有限公司page1of82IPCA600RevisionEAcceptablilityofPrintedBoards印刷電路板檢驗(yàn)規(guī)范批準(zhǔn):審核:編制日期:2007.2.22科技有限公司page3of822.5HolesPlatedThroughGeneral鍍通孔概要鍍通孔概要..............................................................................
2、................................32.5.1NodulesBurrs.鍍瘤毛頭.....................................................................................................................................................................
3、...................32.5.2PinkRing粉紅圈........................................................................................................................................................................................
4、.............32.5.3VoidsCopperPlating鍍銅層破洞...........................................................................................................................................................................32.5.4V
5、oidsFinishedCoating完工皮膜之鍍層破洞.......................................................................................................................................................32.5.5.1LiftedLs(Visual).................
6、...........................................................................................................................................................................32.6HolesUnsuppted未鍍孔未鍍孔.........................
7、.................................................................................................................32.6.1Haloing白圈............................................................................................
8、................................................................................................................32.7PrintedContacts板邊接觸金手指板邊接觸金手指...........................................................................
9、..................................................32.7.1SurfacePlatingGeneral表面鍍層通則.........................................................................................................................................
10、..........................32.7.1.1SurfacePlatingWireBondPads打線承墊之表面..............................................................................................................................................32.7.2Burrs
11、onEdgeBoardContacts板邊接點(diǎn)之毛頭...................................................................................................................................................32.7.3AdhesionofOverplate表面鍍層的附著力..............
12、...............................................................................................................................................32.8Marking標(biāo)記標(biāo)記..............................................................
13、..................................................................................................32.8.1EtchedMarking蝕刻標(biāo)記...................................................................................................
14、....................................................................................32.8.2ScreenedInkStampedMarking網(wǎng)印或蓋印標(biāo)記..................................................................................................
15、............................................32.9SolderResist(SolderMask)防焊綠漆)防焊綠漆......................................................................................................................32.9.1CoverageOverCon
16、ducts(SkipCoverage)邊線表面之覆蓋性(覆蓋不全、跳?。?.......................................................................................32.9.2RegistrationtoHoles(AllFinishes)對孔的套準(zhǔn)度(各種表處理層)............................................
17、......................................................................32.9.3RegistrationtoOtherConductivePatterns其它焊墊的對準(zhǔn)度...................................................................................................
18、...........................32.9.3.1BallGridArray(SolderResistDefinedLs)球腳格列體之焊墊(綠漆設(shè)限之焊墊)................................................................................32.9.3.2BallGridArray(CopperDefinedLs)球腳格列體(銅面設(shè)限之焊墊)
19、.....................................................................................................32.9.3.3BallGridArray(SolderDam)球腳格列體防焊堤...............................................................................
20、................................................................32.9.4BlistersDelamination起泡分層..............................................................................................................................
21、..............................................32.9.5Adhesion(FlakingPeeling)附著力(破片或剝落)......................................................................................................................................
22、........32.9.6WeaveWrinklesRipples波浪起皺紋路.............................................................................................................................................................32.9.7Tenting(ViaHoles)
23、蓋孔(導(dǎo)通孔、過孔)...........................................................................................................................................................32.9.8SodaStrawing吸管式綠漆浮空..............................
24、................................................................................................................................................32.10PatternDefinitionDimensional圖形尺寸特性圖形尺寸特性...............................
25、..........................................................................32.10.1ConductWidthSpacing線寬與間距...................................................................................................................
26、.......................................32.10.1.1ConductWidth線寬..............................................................................................................................................................
27、..........................32.10.1.2ConductSpacing導(dǎo)線間距.......................................................................................................................................................................
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