激光清洗及其應用外文文獻翻譯、中英文翻譯、外文翻譯

1、附錄：英文翻譯激光清洗及其應用W.D.Song#, M.H.Hong,B.Lukyanchuk and T.C.ChongData Storage Institute,Agency of Science,Technolgy and Research,DSI Buliding, No5,Engineering Drivel, Singapore 117608, REPUBLIC OF SINGAPORE摘要：干激光清洗，蒸汽激光清洗及濕激

2、光清洗的機械裝置、特性及其應用將在本文中論述。 在干激光清洗中，粒子被像盤形一樣粒子及［或］基體的感應激光快速熱膨脹能從基體中逃 逸出來，這些物體要承受大范圍的清洗力，這一清洗力能克服粒子與物體表面的分子力或在 接近激光束的影響區(qū)對于球形粒子的效應。對于蒸汽激光清洗，粒子能被通過激光束在物體 表面上形成的液體幕上的快速熱膨脹的爆炸力所移除，相比之下，在濕激光清洗中，粒子能 被通過激光束在液體中產(chǎn)生的液體射流和振蕩波所清除。激光清洗在半導

3、體和磁盤機工業(yè)也 得到應用。介紹然而在俄國，美國，德國的三個組織同時在1987年發(fā)現(xiàn)了激光清結效果，激光清洗己引 起越來越多的科學家和工程師的注意，激光清洗可以分為三類，干激光清洗，水蒸氣激光清 洗以及濕激光清洗。在干激光清洗中，粒子能被移動在的感應激光快速熱膨脹下的物體或盤 型零件/或移動基片或感應激光在影響區(qū)的附近球形的粒子影響。在蒸氣的激光清洗中，粒 子被一個由于以在液體和基片表面之間的界面過熱的液體薄膜在感應激光的爆發(fā)汽化下移

4、 動。一個與這二技術有關的問題是由于直接的激光輻射在基片表面之上感應的高溫。因為基 片那些對高的溫度上升是敏感的，最好的方法是一個激光間接地照射在基片上。最近，我 們試著使用一個激光在液體里清洗基片。當一激光束被聚焦于液體中時它能在聚焦點產(chǎn)生大 量的氣泡，這些泡沫向基體移動而去清洗。由于氣泡-基體或氣泡自由表面的相互作用，高 速的液流能在氣泡爆破的瞬間形成震蕩波，其震動波是在靠近基體表面的氣泡爆破瞬間產(chǎn) 生?；谶@些感應激光的液

5、流和震動波，基體粒子能有效的移動而不會引起基體表面的高溫 抬升。于干激光清洗和蒸汽激光清洗相比我們稱這種方法為“濕激光清洗”，接下來，我們 將討論這三indirectly irradiates the substrates. Recently, we tried to use a laser to clean substrates in liquid. When a laser beam is focused into liquid

6、 , it creates a lot of bubbles there.The bubbles migrate towards a substrate to be cleaned. Due to bubble-substrate and/or bubble-free-surface interaction, a high-speed liquid jet is formed during bubble collapse and a s

7、hock wave is generated at the moment of bubble collapse near the surface . By these laser-induced liquid jet and shock wave , particles on a substrate can be effectively removed without resulting in high temperature rise

8、 of the substrate surface. We call this method as 'wet laser cleaning'as compared to dry laser cleaning and steam laser cleaning . Following, we will discuss these three cleaning techiques and their applications

9、.Dry laser cleaningThe schematic diagram of dry laser cleaning of plate-like particles and SEM(scanning electronic microscope ) images of plate-like particles are shown in Figi. When a laser irradiates a substrate with p

10、late-like particles on it the substrate and /or particles will absorb laser enery. as laser energy is strongly absorbed by a substrate,. 1(a). In contrast, as laser energy is strongly absorbed by plate-like particles , t

11、he cleaning force is induced by fast particle expansion as shown in Fig. 1(b). These cleaning forces induced by fast thermal expansion of the substrate and/or particle can overcome adhesion forces between particle and su