固化工藝與溫度沖擊對導(dǎo)電膠強度的影響.pdf

1、三峽大學(xué)碩士學(xué)位論文固化工藝與溫度沖擊對導(dǎo)電膠強度的影響姓名：毛玉平申請學(xué)位級別：碩士專業(yè)：機械設(shè)計及理論指導(dǎo)教師：游敏20040401AbstractInthisdissertationitreptedtheclassesconstitutionphysicsstructureconductivitybondmechanismofelectricallyconductiveadhesivesresearchprogressinthis

2、fieldalloverthewld.Onthebasisofthesethethesisanalyzedtheapplicationsadvantagesofhighperfmanceconductiveadhesivesintheviewofeconomicalenvironmentprotectionpointouttheapplicationareaofcopperfilledconductiveadhesivewillbeme

3、extended.TogainabetterunderstingofthistypejointfailuremechanismthemajstrengthaffectfactwestudiedtheHT1012copperfilledconductiveadhesive.AlltheresearchwkwascarriedbythetestingmethodsoftensileshearstrengthFouriertransfminf

4、raredspectrometry(FTIR)scanningelectronmicroscopy(SEM)straingaugesmeasurements.Thecuringparameterofthistypeadhesivewasinvestigatedfoundoutthemostoptimalcuringparameterfthisadhesive.Thetensileshearstrengthvalueofthisadhes

5、ivejointsobtainonthisconditionislargerthanthevaluesuppliedbythemanufacturer.Thisconclusionhascertainreferencemeritfmanufacturerindustryapplication.Effectsofthermalcyclingshockontheperfmanceoftheconductiveadhesivejointswe

6、reevaluated.Itwasobservedthattheperfmanceofthejointswasdistinctlydeteriatedafterhighlowcyclingtemperatureshock.Areasonableexplanationofthisphenomenonwasgivenbasedupontheconceptofinternalstresswhichwasinducedduringthether

7、malcyclingshockwhichwasrelatedtothedifferentthermalconductiveabilitydifferentcoefficientofthermalexpansionoftheconductiveadhesivematerialthemetalsubstrates.Itisthefirsttimeusingtheembedstraingaugesmethodtomeasurethemovem

8、enttrendofinternalstressoftheadhesivelayerwhichwasinducedduringthecuringprocess.Thiscanfurtherexplainthebondfailurecause.Fromtheexperimentresultwecandrawconclusionsthat:1)fthistypeadhesivejointswhichneedhightemperaturecu

9、ringweshouldletthejointsprecuringfabout50minutesunderroomtemperaturethenplacetotheovenffurthercuringsothattoensurethejointsstrength2)thedurabilityofthistypeconductiveadhesiveisheavyrelatedtothecyclingofthethermalstress.U