拋光墊表面構(gòu)造和組織對CMP影響效果的研究.pdf

1、大連理工大學碩士學位論文拋光墊表面構(gòu)造和組織對CMP影響效果的研究姓名：劉波申請學位級別：碩士專業(yè)：機械制造及其自動化指導教師：康仁科20061226拋光墊表面構(gòu)造和組織對CMP影響效果的研究StudyontheEffectsoftheSurfaceTextureandConstituentofthePadinCⅧAbstracl：Currently，ChemicalMechanicalPolishing(CMF)isthemostef

2、fectivetechnologytoobtaintheultrasmoothanddamagefreeSulfax：eofwaferandtheonlywaytoachieVethelocalandglobalplanarizationofwaferPolishingpadisthemainconsumablesoftheCMPnlcsurfacetextureandconstituentofthepaddirectlyaffects

3、itsperformancesandeventheCMPprocessGroovingonthepadsurfaceisfillimportantwaytoimproveitsp甑tormaneesnleshapesizeanddistributionofgrooves013thepadeffectthefluxandpressuredistributionofslurrybetweenwaferandpadinCMPHoweversu

4、chstudiesastheformingprocessofgroove011thepadandtheroleofgrooveintheCMPhavebeenrarelylc130rtcdAnewgroovingmethodbasedlaserengravingtechnologyispresentedinthesisnlegrooveswithvariousdistributingshapesuchashomocentriccircl

5、e，squareandinvolute，areproducedbyUSeofthetechnology，andtheeffectsoftheshapesizeanddistributionofthegroovesafeinvestigatedAddingabrasiveintopadfixedabrasivepadisalso雛effectivemethodtoimprovetheperformancesofthepadtheunifo

6、rmityoftheabrasivedistributionbetweg)nthepadandwafercanbeimprovedbyusing觸edabrasivepadSO器teducethematerialremovenonuniformityonwafersulfaceandinc“xl∞theplanarizationrateFurthermorewhenabrasivesdesquamatefromthepadsurface

7、inpolishingthepadmaintainsporousandroughsurfacethisreducethetimesofconditioningpadandprolongthepadlifeTheme粥ur鼬entandevaluationmethodsofpropertiesofthe丘xedabrasivepadsuch嬲mierostructurehardness，density，compressionratiesi

8、liencerate，surface1oughne$$andpolishingfluidabsorptioncapacityfllestudiedThrougheontrastiveexperimentswiththepolishingpadwithoutabrasive，theeffectsofthefixedabrasivepadinCMPareanalyzedThroughgroovingOilthe丘xedabrasivepad