深亞微米光阻殘留顆粒的研究.pdf

1、目錄摘要..........................................................................................................……，........……1Abstract.……，....................................................................................

2、.......................……2第一章緒論..……，..............................................……，.............................................……31.1中國(guó)半導(dǎo)體的發(fā)展............................................................................

3、.......……31.2激烈競(jìng)爭(zhēng)的IC制造業(yè).........................……，.............................................……41.3良率...........................................................................................................……41.4晶圓表

4、面污染物的分類與濕法清洗簡(jiǎn)介...............................................……51.5課題的提出..............................……，...........……，...............……，.……，........……，.6第二章深亞微米顆粒在多晶硅柵工藝中的危害二，.........................……，............……72

5、.1深亞微米污染物導(dǎo)致的產(chǎn)品問題....................................................……，……72.2對(duì)于缺陷性質(zhì)與影響的分析...................................................................……82.3深亞微米表面污染物的來源.............................……，..............

6、.................……92.4本章小結(jié).................................................................……，.........................……H第三章深亞微米污染物的產(chǎn)生和分析........……，............................................……123.1間接觀測(cè)深亞微米污染物的方法..……，

7、................................................……123.2間接觀測(cè)法的應(yīng)用實(shí)驗(yàn).........................................................................……143.3SPM槽污染物的來源.…__....……_二，_二，.甲.……，.…_，_._.........……_.....……，......……巧3.4本章小結(jié)

8、二，............................................................……_......................……，.…17第四章深亞微米污染物去除工藝的優(yōu)化........................................................……184.1污染物的微觀分類...……，................................

9、......................................……184.2污染物的去除機(jī)理以及影響因素........................................................……184.3SCI清洗與兆聲波技術(shù).……，....................……，....................................……，二204.4優(yōu)化濕法光阻剝離后的清洗工藝.

10、.....................................……，...........……234.5木章小結(jié)....……，..................................................……，.......……，..............……25第五章深亞微米污染物的監(jiān)控方法.......................................................

11、.........……265.1放大檢測(cè)法的應(yīng)用實(shí)驗(yàn)..............................……，................................……265.2SPM藥液的使用時(shí)間與檢測(cè)結(jié)果的關(guān)系...........................................……275.3檢測(cè)工藝過程中的系統(tǒng)誤差..…，....……_.................……，...........

12、..……，...……285.4如何回收利用檢測(cè)控片……，....................................……，....................……295.5本章小結(jié)....................................................……，....................……_…，..……_.…30第六章總結(jié)與展望_...……，..................

13、....……，.............……，.……，........................……316.1深亞微米顆粒研究結(jié)果總結(jié).................……‘..........……，......................……316.2清洗技術(shù)發(fā)展趨勢(shì)展望............................……_.....................................……32參考文獻(xiàn)..

14、..............................................................................……，.......................……34致謝..............................................................……，....……，..…，....................……，.....……36Ab

15、straCtAsthegeometryoftheICdevices15getingsmallerandsmaller，themanufaettlreteehniquesmustbecontinuouslyoPtintized.For0.13件mlogicProeess，afterPhotesistarieestriPProcessbefePolyeteh，someverysmallPartieleslessthan0.1件mwhiehe

16、annotbedeteetedbythemeasurementtoolarefound.It15revealedthatthesetinydefeetswilleausePolyresidueissueandlowyieldissue.ToobservethesetinyPaltieles，anindirectmeasurementmethodinWhiehthetinyPaltieleswillbema加fiedbyPolyDEP15

17、ProPosed.Withthisnewmethod，theeontaminatedSPMbathwasfoundandtheeontajminationsouree15eonfirnledasAA一ETProcessduetoitsPolymerresidualsafterdryeteh.TWooPtimizedProeessesaresuggested:1)APPlyingmega一soniefunetioninSCIeleanaf

18、terPR一striPeanimProvetinyPartielesremovalrate，andthePoly一51filmwillnotbedamagedbyhighenergymega一sonie:2)SeParatingAA一ETProcessfromthekeyfilmeleanProeesstoavoiderosseontamination.ThistwooPtimizesolutionseanProvidesteadywe